TGASIA Archives

November 2008

TGAsia@IPC.ORG
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Subject:
Re: FW: Width of solder pad specification
From:
MTD-AD4/AD5 Wei Jian Kang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, MTD-AD4/AD5 Wei Jian Kang <[log in to unmask]>
Date:
Fri, 7 Nov 2008 16:27:34 +0800
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