Dear Technet,
Our company were confused for Bonding criteria of IPC-A-610D & J-STD-001DS, are:
## IPC-A-610D
(1) For item 7.3.2, at top page "These criteria do not apply to SMT components"
Currently, our products had many SMT components which were required bonding but we don't know how to accept for applying and inspecting. And have any criteria mention to bonding for SMT part?
Please kindly advise us.
(2) The first clause of acceptance "On a horizontally mounted component the adhesive adheres to component for at least 50% of its length (L), and 25% of its diameter (D), ON ONE SIDE..."
We think we were confused for "ON ONE SIDE". On 1 component, will be bond ONE side or TWO side to meet this clause?
Please help us to understand obviously.
Please see our sample as link http://picasaweb.google.com/johnynhluan/SMT_BondingConfusing#5270655325850645730
## J-STD-001DS
Item#10-d, "When coating, encapsulation, or staking materials are applied to through-hole glass, ceramic body, or hermetic components, the components SHALL be protected to prevent cracking,..."
We were confused this clause with 2 cases:
(1) Case #1: "... applied to
+ THROUGH-HOLE Glass components
+ THROUGH-HOLE Ceramic body components
+ Or THROUGH-HOLE hermetic components
(2) Case #2: " ... applied to
+ THROUGH-HOLE glass components
+ Ceramic body components
+ Or hermetic components
Please help us to understand obviously.
Thank you very much.
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Nguyen Hoang Luan
QC&Training Supervisor
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask]
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