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November 2008

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Subject:
Re: FW: Accelerated reliability model for SAC405/305 solder joint creep-fatigue
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 10 Nov 2008 17:10:49 EST
Content-Type:
text/plain
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text/plain (52 lines) 
In a message dated 11/10/08 16:56:28, [log in to unmask] writes:
> Werner
> 
> This is great news.
> 
> Any progress in high cycle fatigue for Lead Free?
> 
> Which of the three Las Vegas workshop will address the new creep fatigue
> model in the most detail?
> 
> 
Hi Scott,
Pb-Free Soldering Processes: Survival, Quality, Reliability: The PROBLEMS and 

Pb-Free Soldering Processes: Survival, Quality, Reliability: The SOLUTIONS 
are really one continuous tutorial broken into 2 pieces to accommodate IPC's 
peculiar needs.
These are the workshops where the SAC creep-fatigue model will be discussed.

Werner
Future workshops:
Pb-Free Soldering Processes: Survival, Quality, Reliability—The PROBLEMS, 
December 8, Dallas, Texas
Pb-Free Soldering Processes: Survival, Quality, Reliability—The SOLUTIONS, 
December 8, Dallas, Texas
Solder Joint Reliability: Part 1—Solder Joint Reliability Fundamentals, March 
29, Las Vegas
Pb-Free Soldering Processes: Survival, Quality, Reliability: The PROBLEMS, 
March 30, Las Vegas
Pb-Free Soldering Processes: Survival, Quality, Reliability: The SOLUTIONS, 
March 30, Las Vegas

> Scott Newland
> 




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