Congratulation,



It’s a big step for the full adopting the Lead free technology, if it based on experience and testing and I assume you need time to verify the module.



What about a model for failures like crakes, whiskers etc.?



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-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Saturday, November 08, 2008 12:15 AM

To: [log in to unmask]

Subject: [LF] Accelerated reliability model for SAC405/305 solder joint creep-fatigue



Hi all,

Just to let everybody know, I have developed a creep-fatigue model for 

SAC405/305 solder joints. It will be published in a presentation at the IPC/JEDEC 

Conference on Transitioning to Lead-Free: Strategies for Implementation on 

December 8 to 10, 2008 in Dallas, TX.



Werner

Future workshops:

Pb-Free Soldering Processes: Survival, Quality, Reliability—The PROBLEMS, 

December 8, Dallas, Texas

Pb-Free Soldering Processes: Survival, Quality, Reliability—The SOLUTIONS, 

December 8, Dallas, Texas

Solder Joint Reliability: Part 1—Solder Joint Reliability Fundamentals, March 

29, Las Vegas

Pb-Free Soldering Processes: Survival, Quality, Reliability: The PROBLEMS, 

March 30, Las Vegas

Pb-Free Soldering Processes: Survival, Quality, Reliability: The SOLUTIONS, 

March 30, Las Vegas







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