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November 2008

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Date:
Fri, 7 Nov 2008 16:48:11 -0800
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TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
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John Burke <[log in to unmask]>
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FYI Werner has developed an Accelerated reliability model for SAC405/305
solder joint creep-fatigue. Details below


John Burke

(408) 515 4992


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, November 07, 2008 2:15 PM
To: [log in to unmask]
Subject: [LF] Accelerated reliability model for SAC405/305 solder joint
creep-fatigue

Hi all,
Just to let everybody know, I have developed a creep-fatigue model for 
SAC405/305 solder joints. It will be published in a presentation at the
IPC/JEDEC 
Conference on Transitioning to Lead-Free: Strategies for Implementation on 
December 8 to 10, 2008 in Dallas, TX.

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