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November 2008

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Thu, 6 Nov 2008 12:17:50 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
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Die attach use ag epoxy with high cl? Non electronic grade of conductive epoxy or poorly cured epoxy? 

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Sent using BlackBerry 





________________________________



From: Roberts, Jon 

To: TechNet E-Mail Forum ; Joyce Koo 

Sent: Thu Nov 06 10:39:07 2008

Subject: RE: [TN] AL CU DENDRTIES INSIDE PLASTIC IC 





Enclosed is picture of the dendrites. 



 



I indicated Al but here is what the report stated:



 



EDX Spectra #1 is from the thick part of the dendrite on the bond pad area, and shows a strong peak of silver (Ag) along with smaller peaks of gold (Au), copper (Cu).   EDX Spectra #2 is the dendrite growth on the Si surface; here the stronger peak is Ag with a trace of Cu.  The wire ball is seen in EDX Spectra #3 and is primarily Au with smaller traces of Ag.



 



 







 







 



 



 



Thanks for any inputs to help understand moisture penetrating the plastic body (through plastic or the area around where the leads enter/exit the body.



 



Sincerely Jon 



 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo

Sent: Thursday, November 06, 2008 7:27 AM

To: [log in to unmask]

Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC



 



The resistivity of the IMC plus voids might got something to do with the failure. 



--------------------------



Sent using BlackBerry



 



 



----- Original Message -----



From: TechNet <[log in to unmask]>



To: [log in to unmask] <[log in to unmask]>



Sent: Thu Nov 06 03:23:52 2008



Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC



 



Apparently, the Obama fever has not stopped TN conversation. Too many old foxes, do not bother I guess.



As to the topic, not our experience. We ran aging tests in elevated temperature on some packages, no bias, and nothing happened. Then we did same with very high current through the bond wires, and got horrible growths of Au/Al IMC products around the bond site. Finally, the bond wires lifted. We draw the conclusion, that the high current caused a temperature rise in the bondwire itself, thus adding some thermodynamic activity.



/Inge



 



 



-----Original Message-----



From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D. (Mark)



Sent: den 6 november 2008 00:09



To: [log in to unmask]



Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC



 



Purple plague is an intermetallic alloy that is formed at the junction of the Aluminum pad where the Gold bondwire is bonded.  But this is not a dendrite.  It is a multi-crystalline growth that appears as a dark or purple ring around the ball of the gold bondwire.  Typically dendrites, which will grow within a contaminated plastic IC, do not contain gold.



All it takes is the aluminum, moisture, and an electric field.



 



In the past purple plague has been generally caused by high temperature whether or not the IC is powered.  It usually causes an open circuit



(eventually) due to Kirkendahl voiding at the interface.  With today's very closely pitched bonding pads the purple plague growth may be able to bridge between two adjacent bonding pads.



 



But again, this is not a dendrite.  Dendrites need an electric field to induce growth, purple plague occurs in the absence of an electric field.



It occurs at some rate continuously, but at normal operating temperatures grows so slowly that it is not considered a primary factor in calculating the lifetime of an IC.



 



mark



 



Mark Woolley



PTRL Laboratory



Avaya,  1300 West 120th Ave,   Area 33,  Westminster, CO, 80234



 



-----Original Message-----



From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon



Sent: Tuesday, November 04, 2008 3:39 PM



To: [log in to unmask]



Subject: [TN] AL CU DENDRTIES INSIDE PLASTIC IC



 



Has anyone have knowledge or experience with AL Cu Dendrites growth in plastic IC components?  Reports or other information is appreciated, Thanks, Jon



 



 



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