Enclosed is picture of the dendrites.
I indicated Al but here is what the report stated:
EDX Spectra #1 is from the thick part of the dendrite on the bond pad
area, and shows a strong peak of silver (Ag) along with smaller peaks of
gold (Au), copper (Cu). EDX Spectra #2 is the dendrite growth on the
Si surface; here the stronger peak is Ag with a trace of Cu. The wire
ball is seen in EDX Spectra #3 and is primarily Au with smaller traces
of Ag.
Thanks for any inputs to help understand moisture penetrating the
plastic body (through plastic or the area around where the leads
enter/exit the body.
Sincerely Jon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, November 06, 2008 7:27 AM
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
The resistivity of the IMC plus voids might got something to do with the
failure.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Nov 06 03:23:52 2008
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Apparently, the Obama fever has not stopped TN conversation. Too many
old foxes, do not bother I guess.
As to the topic, not our experience. We ran aging tests in elevated
temperature on some packages, no bias, and nothing happened. Then we did
same with very high current through the bond wires, and got horrible
growths of Au/Al IMC products around the bond site. Finally, the bond
wires lifted. We draw the conclusion, that the high current caused a
temperature rise in the bondwire itself, thus adding some thermodynamic
activity.
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: den 6 november 2008 00:09
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Purple plague is an intermetallic alloy that is formed at the junction
of the Aluminum pad where the Gold bondwire is bonded. But this is not
a dendrite. It is a multi-crystalline growth that appears as a dark or
purple ring around the ball of the gold bondwire. Typically dendrites,
which will grow within a contaminated plastic IC, do not contain gold.
All it takes is the aluminum, moisture, and an electric field.
In the past purple plague has been generally caused by high temperature
whether or not the IC is powered. It usually causes an open circuit
(eventually) due to Kirkendahl voiding at the interface. With today's
very closely pitched bonding pads the purple plague growth may be able
to bridge between two adjacent bonding pads.
But again, this is not a dendrite. Dendrites need an electric field to
induce growth, purple plague occurs in the absence of an electric field.
It occurs at some rate continuously, but at normal operating
temperatures grows so slowly that it is not considered a primary factor
in calculating the lifetime of an IC.
mark
Mark Woolley
PTRL Laboratory
Avaya, 1300 West 120th Ave, Area 33, Westminster, CO, 80234
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Tuesday, November 04, 2008 3:39 PM
To: [log in to unmask]
Subject: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Has anyone have knowledge or experience with AL Cu Dendrites growth in
plastic IC components? Reports or other information is appreciated,
Thanks, Jon
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