TECHNET Archives

October 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"McGlaughlin, Jeffrey A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, McGlaughlin, Jeffrey A
Date:
Thu, 9 Oct 2008 13:06:48 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (167 lines)
I have heard of some silver solders using Cd to lower melting point, could that be your source?

Jeffrey A McGlaughlin, CID
Engineering Designer
Battelle
505 King Ave
Columbus Ohio 43201-2693
Phone (614)424-7582



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, October 09, 2008 12:53 PM
To: [log in to unmask]
Subject: Re: [TN] Need soldering advice ASAP!

50%

Inge

I have to get an advice soon, because I have consumed a 250 gram box of
cashew nuts while searching for tips , and reach for another one...burp..


----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, October 09, 2008 9:41 AM
Subject: Re: [TN] Need soldering advice ASAP!


Are the voids so huge as to PREVENT good mechanical clamping of the die
for bonding?  - sorry

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
Sent: Thursday, October 09, 2008 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Need soldering advice ASAP!

Ingemar,

Ours used to be CrNiAg backside metallization.

My experience with the resultant AuSnAg alloy that forms is that once it
has reflowed, it virtually is impossible to rework [if you ever wanted
to].

Outgassing of the substrate metallization?  Thin film or thick?
Obviously, thick film worse.

Are the voids so huge as to provide good mechanical clamping of the die
for bonding?  It would seem to have to be absolutely terrible voiding to
cause that.  Is there something else going on, like a flux, or change in
clamping, etc.

Seems like I have bonded some really badly voided parts with out issue

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, October 09, 2008 12:00 PM
To: [log in to unmask]
Subject: [TN] Need soldering advice ASAP!

Hi all, especially the Indi-man,
We have soldered IRC's power MOSFET (100-250  W) dice for a decade
without
problems. They use to be vacuum soldered to a solderable gold thickfilm
Al2O3 substrate with AuSn 50 micrometer preforms. Now there is a
production
stop because of Al heavy wire wedge bonding problems. My analysis of
this
case points at the presence of large voids in the solder joints  or
maybe
partly dewetting (FineFocus is good but the resolution is not sufficient
to
make me sure), something the US mechanical waves don't like. The die
backside is plated with something that I don't recognize: Cadmium over
Silver over Nickel. What the heck is that? Anyone who can figure out if
AuSn
is the best preforms for that plating?
Thanks
/Inge

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------


THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS
SENT FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED
ONLY FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If
you are not the intended recipient, you are hereby notified that any
review, distribution, or copying of this communication is strictly
prohibited. If you have received this communication in error, please
immediately notify the sender by return e-mail, and delete this e-mail
message and any attachments from your computer. [gntx v.1]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2