Anand,
who said aluminum is not viable for ENIG? We have produced some million boards with Al wedge bonding on ENIG. In fact, you bond on the underlying nickel. If the gold is thin, which is the case with ENIG, no hazardous IMCs will grow.
Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Anand
Sent: den 1 oktober 2008 23:03
To: [log in to unmask]
Subject: [TN] Electrolytic (Flash) Nickel Gold Finish

Hi All,

I want to use Alluminum WEDGE wire bonding for COB.
as the ENIG is suitable only for Gold Wire Bonding .....! which i don't want.

I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum wire bond can be used.

but i don;t know the recommended thickness of nickel and Gold for

A) Electrolytic ?????? I didn't found any ipc std for this ?

B) Can any ONE please guide me for the thickness of this plating....!

C) again as there is no phosphurus used in electrlytic process how can we
    prevent the corrosion for this plating ?

 thanks and eagerly waiting for the answer on above three questions .....



Regards,
Anand

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