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October 2008

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Wed, 8 Oct 2008 14:03:28 +0100
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Experience is Be Cu can present difficulties to electronic grade fluxes.
This is not very common so I am not sure of the mechanism. The properties of
copper, like many metals, can be changed substantially by the presence or
absence of quite small additions so it is possible that the small amount of
Be does this. If there  were a Be rich zone on the ribbon surface this would
give BeO (beryllia) which is equivalent to wood in soldering terms. 
Alternatively it is as likely the difficulty is related to the treatment the
material receives in manufacturing it --, tempering annealing etc  - to make
it hard/springy etc. (Which is why CuBe is used). This could well produce a
hard to solder surface which is attributed to the Be.

Regards 

Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Tuesday, October 07, 2008 3:47 PM
To: [log in to unmask]
Subject: [TN] SOLDERING BERYLLIUM COPPER

Is there any issue with soldering a crimp style contact that is beryllium
copper with gold finish?  I am used to having nickel barrier over the base
material.  Internet search does find you can but it indicates it is not a
strong connection.  Thanks, Jon 


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