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October 2008

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TechNet E-Mail Forum <[log in to unmask]>, Anand <[log in to unmask]>
Date:
Wed, 1 Oct 2008 16:02:42 -0500
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Hi All,

I want to use Alluminum WEDGE wire bonding for COB.
as the ENIG is suitable only for Gold Wire Bonding .....! which i don't want.

I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum wire bond 
can be used.

but i don;t know the recommended thickness of nickel and Gold for 

A) Electrolytic ?????? I didn't found any ipc std for this ?

B) Can any ONE please guide me for the thickness of this plating....!

C) again as there is no phosphurus used in electrlytic process how can we   
    prevent the corrosion for this plating ? 

 thanks and eagerly waiting for the answer on above three questions .....



Regards,
Anand 

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