Yong,
I refered IPC 2221 for ENIG and other plating but i don't
find thickness for Flash Electrolytic gold ? thickness mensioned in IPC is
only for Eletrolysis Process only.
if you can help me to get the thickness of Electrolytic Flash gold will help
me alot.
Thanks
Regards,
Anand
On Mon, Oct 6, 2008 at 8:38 PM, Yong How GOH <[log in to unmask]> wrote:
> Hi Anand,
>
> You may wish to refer to IPC-2221.
> There's a table which lists the min. thickness for the different surface
> plating requirements.
>
> Hope this is what you are looking for.
>
> Regards
> YH Goh
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of anand paliwal
> Sent: Friday, October 03, 2008 10:40 PM
> To: [log in to unmask]
> Subject: Re: [TN] Electrolytic (Flash) Nickel Gold Finish
>
> This is reply from our Fabricator from china even from the COB
> fabricator
> that it is difficult and they got feedback from different client so
> suggested not to use Alumin. for ENIG. so i am moving to wards Flash
> gold.
> but nobody is commenting on the thicknesses for Flash gold.
> Please do comments on what should be thickness of gold and nickel in
> Flash
> gold plating ?
>
>
> Thanks
> Regards,
> Anand
>
>
> On Thu, Oct 2, 2008 at 1:00 AM, Hernefjord Ingemar <
> [log in to unmask]> wrote:
>
> > Anand,
> > who said aluminum is not viable for ENIG? We have produced some
> million
> > boards with Al wedge bonding on ENIG. In fact, you bond on the
> underlying
> > nickel. If the gold is thin, which is the case with ENIG, no hazardous
> IMCs
> > will grow.
> > Inge
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Anand
> > Sent: den 1 oktober 2008 23:03
> > To: [log in to unmask]
> > Subject: [TN] Electrolytic (Flash) Nickel Gold Finish
> >
> > Hi All,
> >
> > I want to use Alluminum WEDGE wire bonding for COB.
> > as the ENIG is suitable only for Gold Wire Bonding .....! which i
> don't
> > want.
> >
> > I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum
> wire
> > bond can be used.
> >
> > but i don;t know the recommended thickness of nickel and Gold for
> >
> > A) Electrolytic ?????? I didn't found any ipc std for this ?
> >
> > B) Can any ONE please guide me for the thickness of this plating....!
> >
> > C) again as there is no phosphurus used in electrlytic process how can
> we
> > prevent the corrosion for this plating ?
> >
> > thanks and eagerly waiting for the answer on above three questions
> .....
> >
> >
> >
> > Regards,
> > Anand
> >
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>
>
> --
> With Best Regards,
> Anand Paliwal
>
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>
>
--
With Best Regards,
Anand Paliwal
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