Hi Doug

Potting & Encapsulation

I would suggest that you might need to extend this to include  
impregnating varnish and protective laquers. These are all, IMHO,  
different to conformal coatings and have correspondingly different  
protective demands. I would be a  willing supporter of the TG.

Component Cleanliness

I wonder if this might be better handled through solderability testing  
as required through J-STD002 and 003? Surely such surface issues would  
affect solderability/wetting, so it might be an easier and more  
accurate method that could be defined through RR testing. I would be a  
willing supporter of the TG.

Graham Naisbitt
Gen3 Systems

On 29 Sep 2008, at 16:07, Douglas O. Pauls wrote:

> Good morning all,
>
> We had a successful round of meetings at the IPC Midwest Expo in
> Schaumburg, IL, this last week.  I hope that you had time and budget  
> to
> attend.
>
> One of the action items that I have as chairman of the Cleaning and
> Coating General Committee is to determine if there is sufficient  
> interest
> and volunteers to form two new task groups.
>
> The first would be a Task Group on Potting and Encapsulation.  The  
> IPC has
> groups devoted to conformal coating, but none really on potting and
> encapsulation.  So, would you find a group on potting and  
> encapsulation to
> be of benefit and would you be willing to be part of it.
>
> The second would be a Task Group on Component Cleanliness.  We have  
> groups
> that focus on bare board cleanliness and assembly cleanliness, but not
> components themselves.  Again, would you find a group to be of  
> benefit and
> would you be willing to be part of it.
>
> I realize, as do most of the IPC chairmen, that travel budgets are  
> very
> tight or non-existant.  If you volunteer, much of the work can be done
> on-line and by teleconferences.  It might be nothing more than some  
> good
> Technet exchanges.
>
> Let me know your thoughts on these matters.
>
> Doug Pauls
> Rockwell Collins
>
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