Hello TechNet experts, 

 

At the wave soldering process, the solder filling of thermal vias(the via 

holes connected with copper plane by thermal pad) can not fulfill the 75% 

acceptance spec in IPC-610D. Moreover, at the lead free wave soldering 

process, the wetting contact angles of thermal pads exceed 90° often.



My question is how to improve solder filling and wetting contact angles 

for thermal via holes? Thanks a lot.



Best Regards

Charming Chan

PCBA Engineer









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