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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sun, 26 Oct 2008 14:06:21 EDT
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 Nee hao GA Tan,
The Tg of the underfill is not much of a concern; the critical properties are 
the CTE over the application T-range and the modulus of elasticity. It has 
also been shown by work done at Motorola that slow curing underfills [at least 
some] do not give much reliability improvement at low failure probabilies [that 
is the failure distributions become very wide]; whereas snap-cure underfills 
produce tight failure distributions.
You might want to take a look at my reliability column: Engelmaier, W., “
Reliability Improvement with Underfill,” Global SMT & Packaging, Vol. 6, No. 3, 
March 2006, pp. 66-67. 

Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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