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October 2008

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Subject:
From:
Genny Gibbard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Genny Gibbard <[log in to unmask]>
Date:
Fri, 24 Oct 2008 16:22:25 -0600
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Question for the TechNet gurus.
The spec in the subject says that solder touching the component body is
a defect.  But it states that it is allowed for SOTs.
We use a component in a TSFP (thin small flat package).  The
configuration like a 3 lead sot, but the leads are not gullwing - they
come straight out of the device and the whole package mounts flat onto
the board.  It is much smaller than a SOT, on the order of ~1.2mm sq in
total area.
Does this fit in the definition of a SOT?  
The recommended layout actually has the pads start under the device
body.  I'm not sure how you could possibly avoid solder touching the
body.

In general, why is it a defect for solder to touch the component body
for other component types?
Thanks so much for your help.

Genny 

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