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October 2008

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Fri, 24 Oct 2008 10:58:47 -0400
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Technetters,

Anyone care to share some comments on Au embrittlement?
Specifically, what is the relative difference between joints on copper
vs nickel? (For a SnPb joint)

Does Cu inhibit AuSn4 from forming in the bulk solder? Does this have
any effect on Au in the intermetallic layer?
Do the intermetallic compounds containing Au of each joint result in a
similar brittleness?
Do the joints have the same propensity for growth of intermetallic
compounds containing Au?

Any thoughts are welcome.
Ben



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