Can anyone comment on differences between soldering through hard versus soft
gold. 
 
I saw a drawing with specifications for hard gold on pogo pads with 30 micro
inches of soft gold over nickel on solderable surfaces. 
 
Seems like a really weird specification to me. As I recall the rule of thumb
we developed through discussion on this forum was no more than 10 micro
inches per 5 mils of stencil thickness. 

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