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October 2008

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 21 Oct 2008 13:19:12 -0400
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If it is prototype, ok.  If your assembly passed rel test and in production, you need to re qual.  All the new possible failure mech. Could change, including pop corn, thermal cycle, 85 85 bias. Etc. Unless your customer is one of the design only house, couldn't care less about rel issues.  Believe me they are out there in fair numbers. 
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Oct 21 11:21:14 2008
Subject: [TN] Lead Free BGA'S

Our assembly house recently assembled some boards with Lead Free BGA's for us
and when I asked them if they used a lead free process they responded with.

We use leaded solder (Sn63Pb37) with a hybrid oven profile to accommodate the lead-free BGA. I hope this answers your question. Please let me know if you have any more questions."
Is this a common process, is this a reliable process

Any input is appreciated

Thank You
John Foster


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