There is an NPL report that shows that this could be more reliable in
thermal cycle than either all SAC or all SnPb with the balls having
reflowed to produce a 'uniform' alloy. Obviously making an assumption
that some other BGA, thermal cycle routine, pad size etc will be the
same has risks but it was a good report. From memory the NPL under BGA
temp was 217C.


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
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[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: 21 October 2008 16:21
To: [log in to unmask]
Subject: [TN] Lead Free BGA'S

Our assembly house recently assembled some boards with Lead Free BGA's
for us and when I asked them if they used a lead free process they
responded with.

We use leaded solder (Sn63Pb37) with a hybrid oven profile to
accommodate the lead-free BGA. I hope this answers your question. Please
let me know if you have any more questions."
Is this a common process, is this a reliable process

Any input is appreciated

Thank You
John Foster


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