From what I understand, using Pb-free BGAs and SnPb solder requires a reflow profile that stays slightly hotter (above 217°C) slightly longer to ensure the SAC reflows enough to mix adequately with the SnPb paste.

But I don't think there's enough test data available to make a strong conclusion on the reliability.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: Tuesday, October 21, 2008 11:21 AM
To: [log in to unmask]
Subject: [TN] Lead Free BGA'S

Our assembly house recently assembled some boards with Lead Free BGA's for us and when I asked them if they used a lead free process they responded with.

We use leaded solder (Sn63Pb37) with a hybrid oven profile to accommodate the lead-free BGA. I hope this answers your question. Please let me know if you have any more questions."
Is this a common process, is this a reliable process

Any input is appreciated

Thank You
John Foster


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