What Werner says here is very true. A given VPS reflow program will produce much more repeatable profiles than convection reflow ever can, even the improved jet impingment ovens such as the newer BTU ovens. Our process control data from weekly runs in the VPS have a lot less variability (around + - 1 or 2 degrees at most) than our convection ovens (+ - 5-7 deg. C. at best).

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, October 16, 2008 2:29 PM
To: [log in to unmask]
Subject: Re: [TN] Vapor Phase Soldering - The way Forward?


 Hi Eric,
This is another example of the environmentally unfriendly nature of the Pb-ban part of RoHS.
Because of the temperatures reqired for SAC, SnAgXx and SnCuYy solders, assemblies of higher complexity in terms of larger components and/or thicker PCBs, almost invariably will require VPS to assure good wetting and joining up of solder volumes [balls & paste, lead 'tinning' & paste, etc.].
The biggest advantage of VPS is the asymptotic heating to the sump temperature-it just cannot get any higher than that.

Werner


 


 

-----Original Message-----
From: Eric CHRISTISON <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 16 Oct 2008 8:57 am
Subject: [TN] Vapor Phase Soldering - The way Forward?









Subject 

Re: [TN] FW: [LF] Vapor Phase Soldering 
 

 

 


" I should also opine that when soldering RoHS-compliant assemblies using 

lead-free solder paste, you will probably get a much better yield with 

VPS than you ever will with convection. Especially in the case of SAC 

solders. " 
 


Richard's statement prompts me to ask a related question. 
 

The subject of vapour phase soldering came up in a review that I attended this morning on the qualification of a new semiconductor package. It was stated that VP soldering would become a lot more popular in the future because of a number of advantages it has over hot air when using it on lead free components. 
 

What is the opinion of Technet20on this? I'm particularily interested on predictions of it's usage for the manufacture of high volume PWB assys for consumer electronics. 
 

Thanks, 
 

--
Eric Christison Msc 

Mechanical Engineer 

Consumer & Micro group 

Imaging Division 
 

STMicroelectronics (R&D) Ltd 

33 Pinkhill 

Edinburgh EH12 7BF 

United Kingdom 
 

Tel:    +44 (0)131 336 6165 

Fax:    + 44 (0)131 336 6001 
 

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