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Date: | Thu, 16 Oct 2008 15:28:44 -0400 |
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Hi Eric,
This is another example of the environmentally unfriendly nature of the Pb-ban part of RoHS.
Because of the temperatures reqired for SAC, SnAgXx and SnCuYy solders, assemblies of higher complexity in terms of larger components and/or thicker PCBs, almost invariably will require VPS to assure good wetting and joining up of solder volumes [balls & paste, lead 'tinning' & paste, etc.].
The biggest advantage of VPS is the asymptotic heating to the sump temperature—it just cannot get any higher than that.
Werner
-----Original Message-----
From: Eric CHRISTISON <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 16 Oct 2008 8:57 am
Subject: [TN] Vapor Phase Soldering - The way Forward?
Subject
Re: [TN] FW: [LF] Vapor Phase Soldering
" I should also opine that when soldering RoHS-compliant assemblies using
lead-free solder paste, you will probably get a much better yield with
VPS than you ever will with convection. Especially in the case of SAC
solders. "
Richard's statement prompts me to ask a related question.
The subject of vapour phase soldering came up in a review that I
attended this morning on the qualification of a new semiconductor
package. It was stated that VP soldering would become a lot more popular
in the future because of a number of advantages it has over hot air when
using it on lead free components.
What is the opinion of Technet20on this? I'm particularily interested on
predictions of it's usage for the manufacture of high volume PWB assys
for consumer electronics.
Thanks,
--
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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