I did not mean to imply that we solder more than a million joints a
month with VPS, but altogether. I agree with Brian that VPS is not a
good high-volume option. It does work well for the smaller quantities of
backplanes and thicker boards with large or massive component
terminations such as inductors, SMA connectors, etc. It also works very
well for metal-clad boards or thick boards with 2 oz copper ground and
power planes, etc. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Thursday, October 16, 2008 8:28 AM
To: [log in to unmask]
Subject: Re: [TN] Vapor Phase Soldering - The way Forward?

This would have been better as a continuation of the original thread in
the LF forum.

I can't see it being used for high volume work if only because of the
cost.

Brian

Eric CHRISTISON wrote:
> Subject
> Re: [TN] FW: [LF] Vapor Phase Soldering
> 
> 
> 
> 
> 
> 
> " I should also opine that when soldering RoHS-compliant assemblies 
> using lead-free solder paste, you will probably get a much better 
> yield with VPS than you ever will with convection. Especially in the 
> case of SAC solders. "
> 
> 
> Richard's statement prompts me to ask a related question.
> 
> The subject of vapour phase soldering came up in a review that I 
> attended this morning on the qualification of a new semiconductor 
> package. It was stated that VP soldering would become a lot more 
> popular in the future because of a number of advantages it has over 
> hot air when using it on lead free components.
> 
> What is the opinion of Technet on this? I'm particularily interested 
> on predictions of it's usage for the manufacture of high volume PWB 
> assys for consumer electronics.
> 
> Thanks,
> 

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