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October 2008

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 16 Oct 2008 16:28:09 +0300
Content-Type:
text/plain
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text/plain (47 lines)
This would have been better as a continuation of the original thread in 
the LF forum.

I can't see it being used for high volume work if only because of the cost.

Brian

Eric CHRISTISON wrote:
> Subject
> Re: [TN] FW: [LF] Vapor Phase Soldering
> 
> 
> 
> 
> 
> 
> " I should also opine that when soldering RoHS-compliant assemblies using
> lead-free solder paste, you will probably get a much better yield with
> VPS than you ever will with convection. Especially in the case of SAC
> solders. "
> 
> 
> Richard's statement prompts me to ask a related question.
> 
> The subject of vapour phase soldering came up in a review that I 
> attended this morning on the qualification of a new semiconductor 
> package. It was stated that VP soldering would become a lot more popular 
> in the future because of a number of advantages it has over hot air when 
> using it on lead free components.
> 
> What is the opinion of Technet on this? I'm particularily interested on 
> predictions of it's usage for the manufacture of high volume PWB assys 
> for consumer electronics.
> 
> Thanks,
> 

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