TECHNET Archives

October 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Dwight Mattix <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dwight Mattix <[log in to unmask]>
Date:
Wed, 15 Oct 2008 12:48:49 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (56 lines)
It depends.  (Dewey may have trademarked the answer but I have priors it).  :-)

It can be just fine.  You need to do your reliability due diligence 
based on your particular supplier and your particular pwb.  Stronger 
isn't always better. Sometimes it just means something else in the 
chain breaks -- maybe even sooner.

For example, if the plating closes at the knee but leaves a void in 
the middle of the barrel you risk "blowing the lid off" the via as 
entrapped chemistry expands during reflow.  Ask me how I know. /heh

At 10:56 AM 10/15/2008, Dave Connitt wrote:
>List,
>We are considering changing our vias from plated holes with a tolerance
>of +/-.003 to +.000 -(hole diameter) to basically fill the vias with
>plating. The reason for this is due the the nature of our products. Does
>anybody know of any down side to plating vias closed? The typical finish
>is HASL on our boards and we have been tenting the vias.
>Our goal is to make the via connection as robust as possible. We were
>even considering using z-wires in all vias but plating them shut seems
>much less labor intensive.
>Thanks,
>Dave Connitt CID+
>Printed Circuit Designer
>KDI Precision Products, Inc.
>A Wholly Owned Subsidiary of:
>L3 Communications
>3975 McMann Road
>Cincinnati, Ohio 45245
>Ph. 513- 943-2010   Fax 513-943-2288
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to 
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to 
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site 
>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional 
>information, or contact Keach Sasamori at [log in to unmask] or 
>847-615-7100 ext.2815
>-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2