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October 2008

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Wed, 15 Oct 2008 13:47:14 -0400
Content-Type:
text/plain
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text/plain (129 lines)
I agree with Werner. I am of the opinion that gold is dissolved in the
soldering operation. Would not HASL dissolve the gold?


Paul

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad
Sent: Wednesday, October 15, 2008 10:37 AM
To: [log in to unmask]
Subject: Re: [TN] Process question-Pls reply urgently....!

Werner,
Would the melting solder not dissolve the gold leaving no gold layer?
Thanks.
Syed.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, October 14, 2008 2:20 PM
To: [log in to unmask]
Subject: Re: [TN] Process question-Pls reply urgently....!

 
Hi Anand,
In the process of making PCBs, a codeposit of Sn an Pb is used as an
etch resist. Do make solder out of this codeposit, an excursion to
Liquidus temperatures is used. This however, produced convex solder
covering the Cu traces and pads. since this made placing components more
difficult, HASL was developed, to essentially blow excess liquid solder
off the copper.
So all that should be under HASL is copper.
That has not stopped peole to come up with some rather crazy
combinations.

Werner



 


 

-----Original Message-----
From: anand paliwal <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 14 Oct 2008 1:40 pm
Subject: [TN] Process question-Pls reply urgently....!










Hi All,

I have One question Does the HASL Applied after gold plating ?

is HASL can be used for Different Plating finish ?

Thanks
--
With Best Regards,
Anand

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Hi anand,


 


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