Hi Syed,
Of course it would, but what is the point of having Au under HASL? If you HASL over ENIG you are increasing the chances of brittle interfacial failure, so why do it?
Werner
-----Original Message-----
From: Syed Ahmad <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, 15 Oct 2008 10:36 am
Subject: Re: [TN] Process question-Pls reply urgently....!
Werner,
Would the melting solder not dissolve the gold leaving no gold layer?
Thanks.
Syed.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, October 14, 2008 2:20 PM
To: [log in to unmask]
Subject: Re: [TN] Process question-Pls reply urgently....!
Hi Anand,
In the process of making PCBs, a codeposit of Sn an Pb is used as an etch
resist. Do make solder
out of this codeposit, an excursion to Liquidus temperatures is used. This
however, produced convex
solder covering the Cu traces and pads. since this made placing components
more difficult, HASL
was developed, to essentially blow excess liquid solder off the copper.
So all that should be under HASL is copper.
That has not stopped peole to come up with some rather crazy combinations.
Werner
-----Original Message-----
From: anand paliwal <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, 14 Oct 2008 1:40 pm
Subject: [TN] Process question-Pls reply urgently....!
Hi All,
I have One question Does the HASL Applied after gold plating ?
is HASL can be used for Different Plating finish ?
Thanks
--
With Best Regards,
Anand
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