Hi Tushar,
	    Look at the units: mils vs. mm. 
		
This is what I believed:
IPC-The stress will be on component body as the joint form is with
"lots" of solder volume.

Supplier - The stress will be on solder joints as it is the weakest
compared to the component body.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mankeekar Tushar
Sent: Friday, 10 October 2008 12:54 PM
To: [log in to unmask]
Subject: [TN] Technical query: Land Patterns SMD

Hi,

I am using the IPC 7351 LP Viewer Version 7.03.00 to ascertain the
Solder Land Patterns of Chip Type Resistors in my PCB design. 

 

I have the following query -

The Viewer shows the following dimensions for Vishay and Panasonic
respectively.

Vishay RESC0603X28N:        Pad X= 0.40, Pad Y= 0.45, Pad Space C= 0.70

Panasonic RESC0603X30N: Pad X= 0.40, Pad Y= 0.45, Pad Space C= 0.70

 

However based on the component datasheets specs I work out the following
dimensions.

Vishay 0603: Pad X= 0.50, Pad Y= 0.9, Pad Space C= 1.5

Panasonic 0603: Pad X= 0.65, Pad Y= 0.9, Pad Space C= 1.45

 

Can someone please help me clarify my query?

 

Regards,

--Tushar

 



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