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September 2008

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Subject:
From:
Alan Kreplick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Alan Kreplick <[log in to unmask]>
Date:
Tue, 9 Sep 2008 11:39:46 -0400
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Fabrice,

When I was evaluating X-Ray equipment, I brought precision ball bearings 
(I think they were .050").

Each machine had some sort of measurement tool, but no matter the machine 
or changing focus, tilting 50-75 degrees, etc., the .050" ball bearing was 
my benchmark.

To stop the ball bearing from rolling around on the table or assembly, I 
glued it to a small piece of conductive composite material (left-over wave 
solder fixture stock).


Al Kreplick
Sr. Manufacturing Engineer
Circuit Card Assembly
Air-toAir/Precision Strike/Land Combat
Raytheon Integrated Defense Systems
978-470-9931office
978-245-1702 pager
978-470-4307 fax
[log in to unmask]  



fabrice pires <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/09/2008 11:01 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
fabrice pires <[log in to unmask]>


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Subject
[TN] precise void size measurement






Hi Techneters,

I would like your advices on the best way to calibrate XRay pictures in 
aim to measure precisely voids inside BGA balls, after assembly.
Everyone should agree on the fact slight setup variation on XR equipment 
could change significantly the void size results.

Do you have any trick to improve precision measures whatever the XR 
equipment?
Does the use of any reference/calibration on boards exists in that aim?

Fabrice

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