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September 2008

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Subject:
From:
Scott Westheimer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Scott Westheimer <[log in to unmask]>
Date:
Tue, 30 Sep 2008 15:41:19 -0400
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There is electroless gold that can achieve the gold thickness and be used for gold wire bonding and AL. In a past live we used it to wire bond LED's to PCB's. It may not be as expensive as NI/Pd/AU.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC [log in to unmask]: (919)713-0748Cell NC: (919)961-5364 > Date: Thu, 25 Sep 2008 08:20:06 +0800> From: [log in to unmask]> Subject: Re: [TN] Plating types> To: [log in to unmask]> > Hi Anand,> > > > ENIG is Electroless Nickel Immersion Gold Plating & is not suitable for> Gold Wire Bonding as the thickness of Gold is only 3-8microinches & for> gold wire bonding you would need at least 30-40microinches. Soft Gold> Plating is an electroplating process which can be plated to the required> thickness without any issue, of course at a cost. However if you want to> use ENIG, then some of the Chemistry vendors provide what is called a> Nickel-Palladium-Gold where the bonding is to the Palladium & the gold> is very thin like the ENIG process. But this is suitable for Aluminium> Wire bonding,. Hope this helps. If you need more info pls feel free to> contact me......> > > > Thanks & Best Regards,> > Krishnan C> > Director Of Quality> > > > Sanmina-SCI Corporation (M) Sdn. Bhd.> > Sama Jaya Free Industrial Zone> > 93450 Kuching, Sarawak, Malaysia.> > Tel: 60 82 363 000 Ext 1602> > Mobile: (6) - 012-8888-379> > Fax: 60 82 363 527> > E-mail: [log in to unmask]> > "It is easier to do a job right than to explain why you didn't."> > > > -----Original Message-----> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Anand Paliwal> > Sent: Thursday, September 25, 2008 3:07 AM> > To: [log in to unmask]> > Subject: [TN] Plating types> > > > Hi all,> > i am quite new to this community so pls help me.> > > > What is the Difference between ENIG and Soft gold wire Bondable Plating> ?> > > > is the ENIG type of plating for soft wire bondable ?> > > > i have COB on board so i want to specify Soft Gold wire bondable> plating but > > my fab house gives ENIG.> > > > > > Pls reply > > > > Thanks> > > > Anand > > > > ---------------------------------------------------> > Technet Mail List provided as a service by IPC using LISTSERV 15.0> > To unsubscribe, send a message to [log in to unmask] with following text> in> > the BODY (NOT the subject field): SIGNOFF Technet> > To temporarily halt or (re-start) delivery of Technet send e-mail to> [log in to unmask]: SET Technet NOMAIL or (MAIL)> > To receive ONE mailing per day of all the posts: send e-mail to> [log in to unmask]: SET Technet Digest> > Search the archives of previous posts at:> http://listserv.ipc.org/archives> > Please visit IPC web site> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100> ext.2815> > -----------------------------------------------------> > > CONFIDENTIALITY> This e-mail message and any attachments thereto, is intended only for use by the addressee(s) named herein and may contain legally privileged and/or confidential information. If you are not the intended recipient of this e-mail message, you are hereby notified that any dissemination, distribution or copying of this e-mail message, and any attachments thereto, is strictly prohibited. If you have received this e-mail message in error, please immediately notify the sender and permanently delete the original and any copies of this email and any prints thereof.> ABSENT AN EXPRESS STATEMENT TO THE CONTRARY HEREINABOVE, THIS E-MAIL IS NOT INTENDED AS A SUBSTITUTE FOR A WRITING. Notwithstanding the Uniform Electronic Transactions Act or the applicability of any other law of similar substance and effect, absent an express statement to the contrary hereinabove, this e-mail message its contents, and any attachments hereto are not intended to represent an offer or acceptance to enter into a contract and are not otherwise intended to bind the sender, Sanmina-SCI Corporation (or any of its subsidiaries), or any other person or entity.> > ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text in> the BODY (NOT the subject field): SIGNOFF Technet> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest> Search the archives of previous posts at: http://listserv.ipc.org/archives> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815> -----------------------------------------------------
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