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September 2008

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Tue, 30 Sep 2008 12:44:54 +0300
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Hmm! I thought HCFC-141b was forbidden in the EU??? If it is pure, then
I can easily understand your problem. It will not be a good solvent for
flux residues as it is hopeless for ionic components. It will dissolve
the rosin (even so, not very well) and leave some of the activators
behind. At the same time, I would not guarantee that there would not be
a light attack of the polyimide resin itself. Or do you have a blend?

Nylon is a polyamide and I've never seen a PCB made of nylon!!!

Brian

Juan T. Marugán wrote:
> Brian,
> 
> The solder paste we are using is a ROL0 and the cleaning solven is 141-b.
> 
> We agree with you that something is preventing the adhesion. And about your 
> interesting theory, can you tell us how to "see" the invisible flux residues?
> 
> PD. Correct. It is polyimide, not polyamide.
> 
> Juan
> 
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