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September 2008

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Tue, 30 Sep 2008 10:32:21 +0200
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Juan,
Brian's idea is good (as always). See also IPC-A-610D  10-39 10.4.3 Fig 10-68.  Cloride veils, carbonate stains and white residues are often accepted. The dilemma is on what basis you can tolerate such residues. Try Auger for chemical analysis and 1kV/SEI/SEM WD=1-5mms + polarized LOM for surface examination.
q.e.s.m
Inge





-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Juan T. Marugán
Sent: den 30 september 2008 09:33
To: [log in to unmask]
Subject: Re: [TN] Big problem when coating with Parylene C.

Brian,

The solder paste we are using is a ROL0 and the cleaning solven is 141-b.

We agree with you that something is preventing the adhesion. And about your interesting theory, can you tell us how to "see" the invisible flux residues?

PD. Correct. It is polyimide, not polyamide.

Juan

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