I forgot to correct the term resin with rosin. Sorry for any confusion.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Monday, September 29, 2008 2:10 PM
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
IPA can remove water sol fluxes but it's much better to use water, but
water won't look at resin as you say.
A semi-aqueous cleaner could remove both a water sol flux and resin, but
there could well be an interaction between the two fluxes during
soldering if used together which could lead to difficult to remove
products or initiate/increased rate of pyrolising leading to insoluble
residues. Hence my comment about 'gruesome mixture' and question to
know what is actually being contemplated.
[A high activity flux could just be a high solids RA rosin or an OA as
you say.]
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, September 29, 2008 7:12 PM
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
Thanks for answering my question, Roger, before it was even posted.
Now, I'd like to know who qualified HAL (hot air leveled Sn, which I
assume is different from ISn). How was it qualified?
And getting back to the original question: "Is there any negative or
positive impacts of assembling HAL coated boards with some parts being
tin only using hand soldering with very active flux and 63/37 resin core
solder?"
To clarify, you are taking a circuit board with a tin-only finish, and
you are going to solder components also having a tin-only finish using a
resin-cored (to me resin-core means RMA or RA) Pb63Sn37 wire solder, and
you are going to use a "highly activated" benchtop flux to do the
soldering, which I would assume is a water-soluble OA flux.
Then the answer is yes, you are going to have problems.
If you were going to solder this combination using a lead-free solder I
would say you are planting yourself a veritable garden from which
millions of tin whiskers could sprout. But you are not, you are using a
leaded 63/37 solder, so my first inclination is that you should be OK
from a whisker standpoint, as the lead in the Sn63Pb37 wire solder
should mitigate whisker growth.
But when you speak of using what I assume is a highly active water
soluble liquid benchtop flux and mixing it with the RMA or RA flux
residues from the cored wire solder, then yes, you will have issues of
cleanliness. Whenever you mix those two, the ensuing mess is almost
impossible to clean completely. One reacts with water, the other reacts
with alcohol.
Never the twain should mix.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, September 29, 2008 12:16 PM
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
Explain to me the difference between Hot Air Solder Leveled (HASL) and
Hot Air Level (HAL).
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Monday, September 29, 2008 11:56 AM
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
Actually,
The boards are HAL, not HASL finish. At least that's what he told me..
I was just wondering if there could be any detrimental effects from
switching from HASL to HAL and use the same 63/37 resin core solder. I
am not too sure what he is using the flux for if the solder has flux in
it already. Just relaying information.
Dave Connitt
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Willis
Sent: Monday, September 29, 2008 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
If you have HASL Hot Air Solder Levelled boards and tin finish component
and they are both solderable why would you need to use a highly
activated flux?
Any no clean product from many industry suppliers should work perfectly
well.
Many thanks, sorry to give a basic answer?
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop"
24th March www.ASKbobwillis.com/faworkshops.pdf
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: 29 September 2008 17:12
To: [log in to unmask]
Subject: Re: [TN] HAL finished circuit boards
".....very active flux and 63/37 resin core solder......."
Sounds gruesome mixture.
The impact: a rigorous cleaning procedure would be required What that
would be would depend on which very active flux and what type resin?
Regards
Mike Fenner
Indium Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Monday, September 29, 2008 12:33 PM
To: [log in to unmask]
Subject: [TN] HAL finished circuit boards
Good Morning,
Is there any negative or positive impacts of assemblying HAL coated
boards with some parts being tin only using hand soldering with very
active flux and 63/37 resin core solder? An old customer asked me this
over the weekend and I thought I would forward the question to the list.
Thanks,
Dave Connitt CID+
Printed Circuit Designer
KDI Precision Products, Inc.
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010 Fax 513-943-2288
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