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September 2008

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Subject:
From:
"Douglas O. Pauls" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 29 Sep 2008 10:58:04 -0500
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text/plain
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text/plain (106 lines)
Phil,
I would expect the first effort to be a guideline or handbook.  Some form 
of educational lessons learned type of document.  Subsequent work in 
material standards or specifications might be pursued if there is need and 
if an existing industry specification does not exist.

Doug Pauls
Rockwell Collins



Phil Nutting <[log in to unmask]> 
09/29/2008 10:46 AM

To
"[log in to unmask]" <[log in to unmask]>
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Subject
RE: [TN] Potting Encapsulation and Component Cleanliness






Doug,

For potting and encapsulation would the end result be an IPC spec?  I 
think I could commit some of my time to this via electronic meetings as 
travel budgets are essentially non-existent.  I'm sort of the resident 
expert here, but I still have a lot to learn.

Best regards,

Phil Nutting

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Monday, September 29, 2008 11:07 AM
To: [log in to unmask]
Subject: [TN] Potting Encapsulation and Component Cleanliness

Good morning all,

We had a successful round of meetings at the IPC Midwest Expo in
Schaumburg, IL, this last week.  I hope that you had time and budget to
attend.

One of the action items that I have as chairman of the Cleaning and
Coating General Committee is to determine if there is sufficient interest
and volunteers to form two new task groups.

The first would be a Task Group on Potting and Encapsulation.  The IPC has
groups devoted to conformal coating, but none really on potting and
encapsulation.  So, would you find a group on potting and encapsulation to
be of benefit and would you be willing to be part of it.

The second would be a Task Group on Component Cleanliness.  We have groups
that focus on bare board cleanliness and assembly cleanliness, but not
components themselves.  Again, would you find a group to be of benefit and
would you be willing to be part of it.

I realize, as do most of the IPC chairmen, that travel budgets are very
tight or non-existant.  If you volunteer, much of the work can be done
on-line and by teleconferences.  It might be nothing more than some good
Technet exchanges.

Let me know your thoughts on these matters.

Doug Pauls
Rockwell Collins

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