Anand,

The phos content is usually controlled by the plating rate. Various ENIG 
manufactures do contain different phos content so it is best to check with 
the manufacturer for their spec for a desirable phos range. 

The reason that there is an upper limit on Nickel thickness is the plated 
deposit is brittle. As the thickness increases the brittleness increases. 
The IPC has determined that the safe upper limit is 236 um. I am not aware 
of any other major drawbacks from a thicker deposit. If I see a board with 
a thickness of 400 um I would be concerned that the plating rate is two 
high and the process should be looked at to determine if it is being run 
within the manufactures recommendations.

Regards,

Bob Metcalf
Atotech Western Regional Manager

Cell 714-334-7667
E-Mail [log in to unmask] 

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Anand Paliwal <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/24/2008 10:33 AM
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Subject
[TN] ENIG Gold plating






Hi Technetees,

I have some Queries on IPC ENIG 4552  Specifications 

which does not specify Phosphourus content and 
what could be the effects if Electroless Nickel thickness is Greater 236.2 
uin.

As In one of my Board i found this nickel thickness as 400um.

Thanks for reply in advanced.....!


 

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