Technetters,

I am looking for recommendations for solder stencil aperture or aperture 
reduction for a CSP BGA that has 0.30 mm balls and 0.5 mm spacing 
(pitch). On same size balls, but larger pitch we have used 0% reduction 
with great success. This time this ended in disaster with shorts across 
pretty much all the balls. We are using T5 SAC305 solder (yes, we are 
still sticking to that) and a 6 mil stencil. I am thinking about a 50% 
reduction, but I am concerned that the deposit efficiency will be 
terrible and cause opens.

Thank you in advance.

-- 
Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com

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