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September 2008

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Sun, 21 Sep 2008 12:47:23 +0800
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  Yes, please.
  The solderball pin seems to be the patent of Autosplice. 
  Regards!
  Min Jun
  H3C process engineer
  Tel:+86-010-82774234
   
  
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  -----喨周圻周-----
窟周繁: TechNet [mailto:[log in to unmask]] 旗燕 Dwight Mattix
窟僕扮寂: 2008定9埖21晩 11:37
辺周繁: [log in to unmask]
麼籾: Re: [TN] No Subject
  
    Min Jun,
  
  Have you been talking w/ Autosplice? They have quite a bit of 
  materials expertise. Their hdqtrs is 1 block from my office.  I have 
  an old PCB/backpanel friend who is at executive level there now.  If 
  you'd like I can fwd your e-mail.
  
  dw
  
  At 06:58 PM 9/20/2008, you wrote:
  >$B!!!!(BNee hao Min Jun,
  >$B!!!!(BFor electroplated nickel obviously you do not have 'back pad'.
The
  >"brittle failure" may indicate
  >$B!!!!(Binsufficient solder temperature.
  >Bring yur cross-sections to my workshop and we discuss the issues on
Monday
  >at IPC Midwest Conference.
  >$B!!!!(B
  >$B!!!!(BRegards,
  >$B!!!!(BWerner Engelmaier
  >$B!!!!2DpQ@-@h@8(B
  >$B!!!!(BEngelmaier Associates, L.C.
  >$B!!!!(BElectronic Packaging, Interconnection and Reliability
Consulting
  >$B!!!!(B7 Jasmine Run
  >$B!!!!(BOrmond Beach, FL 32174 USA
  >$B!!!!(BPhone: 386-437-8747, Cell: 386-316-5904
  >$B!!!!(BE-mail: [log in to unmask], Website: www.engelmaier.com
  >
  >
  >**************
  >
  >Looking for simple solutions to your real-life financial 
  >challenges?  Check out
  >WalletPop for the latest news and information, tips and calculators.
  >
  >(http://www.walletpop.com/?NCID=emlcntuswall00000001)
  >
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