艇挫,Engelmaier!
Thank you very much for your earnest guidance. I am Sorry I have no
schedule to this conference and hope another opportunity in future.
Min Jun
H3C process engineer
Tel:+86-010-82774234
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-----喨周圻周-----
窟周繁: TechNet [mailto:[log in to unmask]] 旗燕 Werner Engelmaier /*
窟僕扮寂: 2008定9埖21晩 9:59
辺周繁: [log in to unmask]
麼籾: Re: [TN] No Subject
Nee hao Min Jun,
For electroplated nickel obviously you do not have 'back pad'. The
"brittle failure" may indicate
insufficient solder temperature.
Bring yur cross-sections to my workshop and we discuss the issues on
Monday
at IPC Midwest Conference.
Regards,
Werner Engelmaier
辛真來枠伏
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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