Hi Vladimir,
cross-section has be done, further analysis is being planned, at present
we have no benchmark, sorry,"Easy to fail" is just from the result of our
several failure case and my understanding to the package/solder jointer.
Best regards!
Min Jun
H3C process engineer
Tel:+86-010-82774234
****************************************************************************
***********
This e-mail and its attachments contain confidential information from
H3C, which is intended only for the person or entity whose address is listed
above. Any use of the information contained herein in any way (including,
but not limited to, total or partial
disclosure, reproduction, or dissemination) by persons other than the
intended recipient(s) is prohibited. If you receive this e-mail in error,
please notify the sender by phone or email immediately and delete it!
****************************************************************************
************
-----喨周圻周-----
窟周繁: Igoshev, Vladimir [mailto:[log in to unmask]]
窟僕扮寂: 2008定9埖20晩 1:54
辺周繁: [log in to unmask]; [log in to unmask]
麼籾: RE: [TN] 基鹸: [TN] Copper BGA balls
I'm sorry to say, but your whole sentence sounds confusing. What so you
mean by saying "easy to fail"? Any benchmarks? How do you know what the
failure path is - any cross-sections/SEM/EDS have been done? How they failed
(off the line/from field and so on.
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Min Jun
Sent: Thursday, September 18, 2008 9:51 PM
To: [log in to unmask]
Subject: [TN] 基鹸: [TN] Copper BGA balls
Hi all and Engelmaier,
How do you think about the reliability of the cooper pin, like TI's
DSSMT or Tyco's CPSB.We found the solder jointer type easy to fail,
especially for lager package with few solder ball. The failure mode is
brittle fracture between Nickel layer and IMC layer.
PLS refer to
focus.ti.com.cn/cn/lit/an/slyt212/slyt212.pdf
www.autosplice.com/us/autosplice/Images/SolderballAppNotes.pdf
Min Jun
H3C process engineer
Tel:+86-010-82774234
****************************************************************************
***********
This e-mail and its attachments contain confidential information
from
H3C, which is intended only for the person or entity whose address is
listed
above. Any use of the information contained herein in any way
(including,
but not limited to, total or partial
disclosure, reproduction, or dissemination) by persons other than
the
intended recipient(s) is prohibited. If you receive this e-mail in
error,
please notify the sender by phone or email immediately and delete it!
****************************************************************************
************
-----喨周圻周-----
窟周繁: TechNet [mailto:[log in to unmask]] 旗燕 Werner Engelmaier /*
窟僕扮寂: 2008定9埖18晩 20:25
辺周繁: [log in to unmask]
麼籾: Re: [TN] Copper BGA balls
Hi Reuven,
In terms of cost reduction, it depends what you are comparing it
to---SnPb
soldering, BGA ball replacement, failures, etc.
I terms of reliabilty---take a look at my reliability column in
GSMT&P
magazine of August 2007
Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture,
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia
**************
Psssst...Have you heard the news? There's a new fashion blog,
plus the latest fall trends and hair styles at StyleList.com.
(http://www.stylelist.com/trends?ncid=aolsty00050000000014)
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following
text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.
16 for additional information, or contact Keach Sasamori at
[log in to unmask]
or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.
16 for additional information, or contact Keach Sasamori at [log in to unmask]
or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
