Nee hao Min Jun,
Now that you say "nickel" and "brittle failure"in one breath, the likelihood 
that you have ENIG's 'back pad' is retty strong.   In these cases, the 
interface between the Ni and the IMClayers is weakened, and sfficient loading causes 
brittle failure.
You should be attending my workshop dealing with this issue this coming 
Monday at IPC Midwest Conference.

Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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