你好！Engelmaier,
Our supplier had provided their reliability report according to IPC
9701，the report shows the test duration is to 63.7% of the cumulative
failure distribution or 6000 thermal cycles. But at present I am more
concerned about the infant failure from external overload, like board warp
or mechanical shock.
Another question is why the weakest point is between nickel layer and
IMC layer. Could you give me some explanation about the failure mechanism of
the brittle fracture.
Best regards!
Min Jun
H3C process engineer
Tel:+86-010-82774234
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-----邮件原件-----
发件人: TechNet [mailto:[log in to unmask]] 代表 Werner Engelmaier /*
发送时间: 2008年9月19日 10:25
收件人: [log in to unmask]
主题: Re: [TN] Copper balls/pins
Nee hao Min Jun,
No, I am not surprised that you are having failures with copper pin
solder
joints--these pins are not compliant leads. What you essentially have is
a
leadless solder connection.
I sure wish these component suppliers would do their reliability
homework.
The 2 pdf's you make reference to either make nonsensical reliability
statements, or obliquely refer to IPC-9701 without giving ay results.
Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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