Hi all and Engelmaier,
How do you think about the reliability of the cooper pin, like TI's
DSSMT or Tyco's CPSB.We found the solder jointer type easy to fail,
especially for lager package with few solder ball. The failure mode is
brittle fracture between Nickel layer and IMC layer.
PLS refer to
focus.ti.com.cn/cn/lit/an/slyt212/slyt212.pdf
www.autosplice.com/us/autosplice/Images/SolderballAppNotes.pdf
Min Jun
H3C process engineer
Tel:+86-010-82774234
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-----喨周圻周-----
窟周繁: TechNet [mailto:[log in to unmask]] 旗燕 Werner Engelmaier /*
窟僕扮寂: 2008定9埖18晩 20:25
辺周繁: [log in to unmask]
麼籾: Re: [TN] Copper BGA balls
Hi Reuven,
In terms of cost reduction, it depends what you are comparing it
to---SnPb
soldering, BGA ball replacement, failures, etc.
I terms of reliabilty---take a look at my reliability column in GSMT&P
magazine of August 2007
Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture,
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia
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