I would try the simple solderability test I use for BGAs. See the procedure
and the posters on the following links. These will explain the test and
provide examples.
I would suggest you also look at the images as a side view on your x-ray
system
www.ASKbobwillis.com/pdfs/p21solderability.pdf
www.ASKbobwillis.com/pdfs/simplesolderability.pdf
Many thanks
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
www.ASKbobwillis.com
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 24th
March www.ASKbobwillis.com/faworkshops.pdf
"Troubleshooting Your Assembly Yields Workshop" 25th March
www.ASKbobwillis.com/faworkshops.pdf
Book Bob's "Step by Step Failure Analysis Workshop" 22nd April
www.ASKbobwillis.com/faworkshops.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: 18 September 2008 16:23
To: [log in to unmask]
Subject: Re: [TN] Copper BGA balls
We are in the process of contacting the manufacturer, but thought I would
see what technetters have to say.
Steve, can you post a couple of pics? These are X-Rays of the parts right
off the reel, before any assembly/reflow.
I'd say it looks like voids but...
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: September 18, 2008 7:32 AM
To: [log in to unmask]
Subject: Re: [TN] Copper BGA balls
I would second Richard, I don't believe the Cu balls are formed the same way
as solder, so it would be impossible they contain voids. Could you check
with the manufacturer if the ball forming is prone to voiding?
Ioan
-----Message d'origine-----
De : Stadem, Richard D. [mailto:[log in to unmask]]
Envoyé : 18 septembre 2008 09:12
À : [log in to unmask]
Objet : Re: [TN] Copper BGA balls
On those types of components, the copper ball shows up like a void. If you
have a good X-ray and you turn up the magnification, the "void" is actually
a light shade of gray, but not as white as a real void.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, September 17, 2008 6:01 PM
To: [log in to unmask]
Subject: [TN] Copper BGA balls
Anyone have experience with components using a tinned copper ball instead of
a SAC alloy solder ball?
Have you ever X-rayed one?
We are seeing voiding that does not meet the IPC-7095B spec for incoming
inspection with a transmission x-ray. However, we don't know if this is a
concern for this type of ball, or if this spec even applies to this type of
ball. I don't think these are meant to collapse and mix with the solder on
the board, like a normal solder alloy ball might.
Once again, thanks in advance for sharing your knowledge.
Genny
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