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| Date: | Thu, 18 Sep 2008 09:31:49 -0400 |
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I would second Richard, I don't believe the Cu balls are formed the same way as solder, so it would be impossible they contain voids. Could you check with the manufacturer if the ball forming is prone to voiding?
Ioan
-----Message d'origine-----
De : Stadem, Richard D. [mailto:[log in to unmask]]
Envoyé : 18 septembre 2008 09:12
À : [log in to unmask]
Objet : Re: [TN] Copper BGA balls
On those types of components, the copper ball shows up like a void. If
you have a good X-ray and you turn up the magnification, the "void" is
actually a light shade of gray, but not as white as a real void.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, September 17, 2008 6:01 PM
To: [log in to unmask]
Subject: [TN] Copper BGA balls
Anyone have experience with components using a tinned copper ball
instead of a SAC alloy solder ball?
Have you ever X-rayed one?
We are seeing voiding that does not meet the IPC-7095B spec for incoming
inspection with a transmission x-ray. However, we don't know if this is
a concern for this type of ball, or if this spec even applies to this
type of ball. I don't think these are meant to collapse and mix with
the solder on the board, like a normal solder alloy ball might.
Once again, thanks in advance for sharing your knowledge.
Genny
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