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September 2008

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Subject:
Re: Copper BGA balls
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Thu, 18 Sep 2008 09:49:56 +0300
Content-Type:
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text/plain (1 lines) 
Hi Werner,



Do you know if the Solder on Cupper over polymer is going to be standard? It's reliability improvement and the cost reduction with high volume, it make it a good start up...



Best Regards



Reuven ROKAH

e mail: [log in to unmask]

Think green before printing this mail... Thanks



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Thursday, September 18, 2008 4:58 AM

To: [log in to unmask]

Subject: Re: [TN] Copper BGA balls



Hi Genny,

Why would you want to use Cu balls--they do not improve reliability, because the ball is too rigid and you wind up with 2 very thin solder joints. Now polymer balls covered in Cu and solder is another matter--they improve reliability.









Werner





-----Original Message-----

From: Genny Gibbard <[log in to unmask]>

To: [log in to unmask]

Sent: Wed, 17 Sep 2008 7:00 pm

Subject: [TN] Copper BGA balls

















Anyone have experience with components using a tinned copper ball

instead of a SAC alloy solder ball?

Have you ever X-rayed one?

We are seeing voiding that does not meet the IPC-7095B spec for incoming

inspection with a transmission x-ray.  However, we don't know if this is

a concern for this type of ball, or if this spec even applies to this

type of ball.  I don't think these are meant to collapse and mix with

the solder on the board, like a normal solder alloy ball might.



Once again, thanks in advance for sharing your knowledge.



Genny



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