Whenever possible a test point should be incorporated into the net which
is merely a pad connected to the net for a probe to touch.  Rex is
correct that the probes can damage the vias.  By using a separate test
point you eliminate the need to involve the via during ICT test.  The
amount of real estate used by the test pads is usually not an issue on
most of the PWBs we design..

Mark woolley

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: Tuesday, September 16, 2008 12:22 AM
To: [log in to unmask]
Subject: Re: [TN] ICT over RoHS Via

Taking the most unreliable part of a pcb (the vias) and repeated
stabbing something sharp into them has always seemed to me to be
something of a foolhardy occupation.  


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eli Sarig
Sent: 15 September 2008 16:59
To: [log in to unmask]
Subject: [TN] ICT over RoHS Via

Hi,


Is there any different within the material type of the ICT probe,
regarding the metal finishing of the PCB?
If I must use the via as a test point, do I need to coat the ENIG
annular ring with solder paste prior to reflow, in order to improve the
surface for the ICT?
Thanks

Eli.

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