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September 2008

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Subject:
From:
Rex Waygood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rex Waygood <[log in to unmask]>
Date:
Tue, 16 Sep 2008 07:21:50 +0100
Content-Type:
text/plain
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Taking the most unreliable part of a pcb (the vias) and repeated
stabbing something sharp into them has always seemed to me to be
something of a foolhardy occupation.  


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
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[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eli Sarig
Sent: 15 September 2008 16:59
To: [log in to unmask]
Subject: [TN] ICT over RoHS Via

Hi,


Is there any different within the material type of the ICT probe,
regarding the metal finishing of the PCB?
If I must use the via as a test point, do I need to coat the ENIG
annular ring with solder paste prior to reflow, in order to improve the
surface for the ICT?
Thanks

Eli.

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