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September 2008

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Subject:
From:
"Roberts, Jon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon
Date:
Wed, 3 Sep 2008 08:56:08 -0500
Content-Type:
text/plain
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text/plain (175 lines)
Gary, thanks, I am sure most of us in this forum understand the proper
packaging. DRS's problem is that the supplier of the assembly failed to
sue proper packaging such as using a Static Dissipative bag first, then
an antistatic materials (bubble wrap)and then into a ESD protective
cardboard container. The results was possibly under covering uncured AR
conformal coating at shipment stage. We are just trying to determine
root cause and how to handle those assemblies already having the bubble
wrap impression. Again I thank all for their inputs and plan to provide
the rest of the story. Sincerely, Jon 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Bremer
Sent: Tuesday, September 02, 2008 2:11 PM
To: [log in to unmask]
Subject: Re: [TN] ANTISTATIC MATERIAL QUESTION

AR Conformal Coating is Acrylic Resin and has nothing to do with ESD
protection.  The boards
 must be first placed in approved ESD bags prior to any other packaging
material.

Gary Bremer

> Date: Tue, 2 Sep 2008 10:54:08 -0700
> From: [log in to unmask]
> Subject: Re: [TN] ANTISTATIC MATERIAL QUESTION
> To: [log in to unmask]
> 
> AR coating, what's that? Sounds like anti reflex coating....
> correct bubble wrap must have conductive stuff all through the
plastic,
> if  I'm not wrong. There is seemingly less reliable stuff with just a 
> conductive
> spray coating, but it's forbidden here. MIL products demand safer bags
and 
> bubble wrap.
> Inge
> 
> 
> ----- Original Message ----- 
> From: "McGee, Michael" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, September 02, 2008 9:39 AM
> Subject: Re: [TN] ANTISTATIC MATERIAL QUESTION
> 
> 
> When you open the bubble wrap, does it smell like solvent? If so, the
> marks are from under cured coating. We have seen a similar problem
with
> AR coating in ESD bags. Added a 3 hr bake at 130F to eliminate the
> problem.
> The bake time/temp would depend on your process/coating/and coating
> thickness.
> 
> -Mike
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
> Sent: Tuesday, September 02, 2008 10:43 AM
> To: [log in to unmask]
> Subject: [TN] ANTISTATIC MATERIAL QUESTION
> 
> We have been noticing if bubble wrap is allowed to come in direct
> contact with a circuit card assembly (non ESD and ESD) sensitive that
> the bubble wrap leaves impression in the AR coating.  Do know if the
> resulting impression is related to uncured coating or reaction of the
> bubble wrap material?  Thanks for any information, Jon
> 
> 
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This communication is intended only for use by the addressee(s) named herein and may contain business confidential and/or legally privileged information. If you are not the intended recipient of this e-mail, you are hereby notified that any dissemination, distribution, disclosure or copying of this e-mail and its contents is strictly prohibited. If you have received this e-mail in error, kindly notify the sender by replying to this message. In addition, please permanently delete the message and any attachments without copying or disclosing the contents. Thank you for your cooperation.                                                                                                        
THIS DOCUMENT AND/OR SHIPMENT MAY CONTAIN COMMODITY ITEMS, SOFTWARE OR TECHNICAL DATA THAT IS CONTROLLED BY U.S. EXPORT LAW, AND MAY NOT BE EXPORTED OUTSIDE THE UNITED STATES OR TO NON U.S. PERSONS WITHOUT THE APPROPRIATE EXPORT LICENSE FROM EITHER THE U.S. DEPARTMENT OF STATE OR DEPARTMENT OF COMMERCE.

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