Hi Inge,
Large fillets have always been a problem source.
Besides causing the obvious tombstoning problem, they put those components 
into vise-like jaws and crack them. CCs are the only issue I am aware of that 
Class 3 product is consistently less reliable than Class 2 product because of 
the offset limitation.
I have been pushing for a long time for soldering pads no wider than half the 
component width, and the elimination ar at least almost elimination of 
fillets on CCs and RCs.
You may want to take a look at my columns in GSMT&P magazine, see Engelmaier, 
W., “Achieving Solder Joint Reliability in a Lead-Free World, Part 1,” 
Global SMT & Packaging, Vol. 7, No. 6, June 2007, pp. 40-42
and 
Engelmaier, W., “Lead-Free (LF) Wave-Soldering: Can (Should) It Be Eliminated,
” Global SMT & Packaging, Vol. 5, No. 9, October 2005, pp. 46-50.

 Skoal [with today's meaning, not of those blood0thirsty Vikings]



Werner



**************
Psssst...Have you heard the news? There's a new fashion blog, 
plus the latest fall trends and hair styles at StyleList.com.
      
(http://www.stylelist.com/trends?ncid=aolsty00050000000014)

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------